IC Package Electrical Design Engineer

As an IC Package Electrical Design Engineer, you will be an integral part of the engineering team and lead packaging for custom in-house photonic, analog, and digital ICs supporting next generation optical modules.

Location

Hybrid, commute to New Providence, NJ 2x weekly

Responsibilities

• Oversee the design and development of advanced IC packages from initial concept to final production, ensuring projects adhere to timelines and specifications.
• Define package architecture, and carry out signal and power integrity analysis along with thermal simulations to optimise performance and reliability.
• Design package interconnects, including wire bonds, flip-chip, and through-silicon vias (TSVs), ensuring they meet electrical requirements and manufacturing constraints.
• Collaborate with semiconductor design teams to establish package pinout, optimise I/O placement, and ensure effective integration with integrated circuits (ICs).
• Perform package-level simulations and tests to validate electrical performance, resolve signal and power integrity issues, and refine designs.
• Develop innovative solutions for challenges related to high-speed signalling, power delivery, and electromagnetic interference (EMI).
• Liaise with suppliers and manufacturing partners to ensure a seamless transition from design to production, addressing any technical issues that arise.

Basic Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering or a related field; a Master’s or PhD is preferred.
• Minimum of 5 years’ experience in IC package electrical design, with a proven record of successful project completion.

Preferred Skills and Experience

• Expertise in semiconductor packaging technologies, including wire bonding, flip-chip, and advanced packaging techniques such as 2.5D/3D integration.
• Experience with package-level simulation tools (e.g., Ansys HFSS, SiWave) and familiarity with electromagnetic simulation methods.
• Strong understanding of signal and power integrity principles, including optimisation of high-speed interconnects and power distribution networks (PDN).
• Proficiency in industry-standard design tools, such as Cadence Allegro, Mentor Xpedition, and/or Keysight ADS.