IC Package Mechanical Design Engineer

As a Mechanical IC Packaging Engineer, you will be an integral part of the engineering team to design and implement next generation optical modules for high performance compute applications.

The ideal candidate will have a strong background in mechanical engineering with a focus on packaging technologies for semiconductor devices including mixed-signal and photonic ICs. They will work closely with cross-functional teams to drive innovation, ensure product reliability, and meet performance requirements.

 
Location
On-site New Providence, NJ

 
Responsibilities

• Mechanical design and development of optical module packaging solutions, including package structure, layout, and material selection.

• Develop and implement testing procedures to validate package designs and ensure compliance with industry standards and customer requirements.

• Identify and resolve technical challenges related to packaging design, assembly processes, and material properties.

• Build and maintain component models and package assemblies using SolidWorks.

• Create component and assembly technical drawings using GD&T best practices.

• Design and develop tooling and fixturing to support package assembly.

• Collaborate with external suppliers, engineering, and operations to ensure seamless integration of optical, electrical and mechanical components.

Basic Qualifications

• BS in Mechanical Engineering.
• 2+ years hands on experience with IC package design.
• Organized with excellent written and verbal communication skills.

Preferred Skills and Experience

• SolidWorks including Product Data Management (PDM).
• ANSYS Mechanical or similar FEA tools.
• Rapid prototyping (experience with Formlabs 3-D printing preferred).
• Design for manufacturing including CNC machining, casting, and MIM.
• Optical module reliability (proficiency in Telcordia GR-468 or similar preferred)
• Advanced IC packaging technologies including 3-D/2.5-D IC, FOWLP, MCM FC-BGA.
• High speed test socket and connectors.